• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a pipette and a method for equipping a printed circuit board with solder paste. The pipette comprises a tubular body (4) for cutting out a defined part of the solder paste from a solder paste depot (5), a piston (6) which rests against an inner wall of the tubular body (4) in such a way that the tubular body (4) is airtight is closed, and means for varying the pressure between the piston (6) and the punched out part of the solder paste.
    公开号:CH713419B1
    申请号:CH00761/18
    申请日:2016-11-15
    公开日:2020-08-14
    发明作者:Hippin Christoph；Müller Robert；Leonhardt Mario
    申请人:Endress+Hauser Se+Co Kg；
    IPC主号:
    专利说明:

    The invention relates to a pipette for loading a circuit card with solder paste.
    When pin transfer, the dispensing material (glue, solder paste) is applied using stamping tools. A direct dispensing station provides a reservoir for the dispensing material. Dosing is achieved using various process parameters such as the layer thickness of the material reservoir and the shape of the stamping tool. With such a method, the dosing results are influenced in an untargeted and uncontrolled manner.
    The invention is based on the object of providing a device for loading a circuit card with solder paste, in which the solder paste can be precisely dosed.
    The object is achieved by the subject matter of the invention. The subject of the invention is a pipette for loading a circuit board with solder paste, comprising a tubular body for cutting out a defined part of the solder paste from a solder paste depot, a piston which rests against an inner wall of the tubular body in such a way that the tubular body is hermetically sealed, and Means for varying the pressure between the plunger and the punched out portion of the solder paste.
    According to an advantageous development, the means for varying the pressure between the piston and the punched out part of the solder paste comprises a membrane which forms an end face of the piston.
    According to an advantageous variant, the means for varying the pressure between the piston and the punched out part of the solder paste comprises a device for moving the piston in the tubular body.
    The invention also relates to a method for equipping a circuit card with solder paste, in particular by means of a pipette according to one of the preceding claims, comprising the steps of cutting out a defined part of a solder paste from a solder paste depot,Sucking the punched out part of the solder paste, placing the punched out part of the solder paste on a circuit board, pressing out the punched out part of the solder paste until the punched out part of the solder paste sticks to the circuit board.
    According to an advantageous embodiment, a defined part of a solder paste is cut out of a solder paste depot by means of the tubular body.
    According to an advantageous embodiment, the pressing out and / or suction of the punched out part of the solder paste by means of the means for varying the pressure between the piston and the punched out part of the solder paste.
    According to a favorable development, the means for varying the pressure between the piston and the punched out part of the solder paste comprises a membrane which forms an end face of the piston.
    According to a favorable variant, the means for varying the pressure between the piston and the punched out part of the solder paste comprises a device for moving the piston in the tubular body.
    [0012] The invention is explained in more detail with reference to the following drawings. It shows:<tb> Fig. 1A-J: <SEP> shows a longitudinal section of a pipette with a membrane as the end face of the piston, which cuts out a defined part of a solder paste from a solder paste depot and places it on a circuit board, and FIG<tb> Fig. 2A-H: <SEP> shows a longitudinal section of a pipette with a movable piston, which cuts a defined part of a solder paste from a solder paste depot and places it on a circuit board.<tb> Fig. 1A-J <SEP> each show a longitudinal section of a pipette which cuts a defined part of a solder paste from a solder paste depot (FIGS. 1A-E) and places it on a circuit board (FIGS. 1F-J). The pipette has a tubular body 4 for cutting out a defined part of the solder paste 3 from the solder paste depot 5. A piston 6 rests against an inner wall 7 of the tubular body 4 in such a way that the tubular body 4 is hermetically sealed. A membrane 8 forms an end face of the piston 6 (Fig. 1A).
    The method for equipping the circuit board 2 with solder paste 3 by means of the pipette 1 comprises the following steps. In a first step, the pipette 1 is placed with the tip first on the surface of a solder paste depot 5 (FIG. 1B). The membrane 8 forms the tip of the pipette 1 and is deflected outwards.
    In a second step, the tubular body 4 is moved in the direction of the solder paste depot 5 until the solder paste depot 5 is completely pierced (FIG. 1C).
    In a third step, the membrane 8 is deflected inwards either mechanically or by means of negative pressure, in order to generate a negative pressure between the membrane 8 and the surface of the solder paste depot 5 (FIG. 1D).
    In a fourth step, the pipette 1 is moved in a direction opposite to the solder paste depot 5, so that the pipette 1 sticks out a defined part of the solder paste 3 from the solder paste depot 5 (FIG. 1E).
    In a fifth step, the pipette 1 is placed tip first on a surface of a printed circuit board 2 (Fig. 1F). The defined part of the solder paste 3 lies on a part of the printed circuit board 2 to be covered with solder paste (FIG. 1G).
    2A-H show a longitudinal section of a pipette with a movable piston.
    In a first step, the pipette 1 is placed with the tip first on a solder paste depot 5 (FIG. 2A).
    In a second step, the tubular body 4 is moved out until part of the solder paste 3 is poked out.
    In a third step, the piston 6 is moved in a direction opposite to the part of the solder paste 3 (FIG. 2C). In this way, a negative pressure arises between the piston 6 and the part of the solder paste 3. This negative pressure causes the part of the solder paste 3 to detach itself from the solder paste depot 5 and to be picked up by the pipette 1 (FIG. 2D).
    In a fourth step, the pipette 1 is placed with the tip first on a circuit board 2 (Fig. 2E and F). In a fifth step, the piston 6 is moved in the direction of the part of the solder paste 3 until an overpressure is created between the piston 6 and the part of the solder paste 3. This overpressure leads to the part of the solder paste 3 being detached from the pipette 1 and being pressed against the circuit card 2 until the solder paste 3 adheres to the circuit card 2.
    List of reference symbols
    1 pipette 2 circuit board 3 solder paste 4 body 5 solder paste depot 6 piston 7 inner wall 8 membrane
    权利要求:
    Claims (8)
    [1]
    1. Pipette for populating a circuit board (2) with solder paste (3), comprisinga tubular body (4) for cutting out a defined part of the solder paste (3) from a solder paste depot (5),a piston (6) which rests against an inner wall (7) of the tubular body (4) in such a way that the tubular body (4) is hermetically sealed,Means for varying the pressure between the piston (6) and the punched out part of the solder paste (3).
    [2]
    2. Pipette according to claim 1, wherein the means for varying the pressure between the piston (6) and the punched out part of the solder paste (3) comprises a membrane (8) which forms an end face of the piston (6).
    [3]
    3. Pipette according to claim 1, wherein the means for varying the pressure between the plunger (6) and the punched-out part of the solder paste (3) comprises a device for moving the plunger (6) in the tubular body (4).
    [4]
    4. A method for equipping a circuit card (2) with solder paste (3) by means of a pipette (1) according to one of the preceding claims, comprising the steps ofCutting out a defined part of a solder paste (3) from a solder paste depot (5), sucking in the cut out part of the solder paste (3), placing the cut out part of the solder paste (3) on a circuit board (2),Squeeze out the punched out part of the solder paste (3) until the punched out part of the solder paste (3) sticks to the circuit board (2).
    [5]
    5. The method according to claim 4, wherein the cutting out of a defined part of a solder paste (3) from a solder paste depot (5) takes place by means of the tubular body (4).
    [6]
    6. The method according to claim 4 or 5, wherein the pressing out and / or suction of the punched out part of the solder paste (3) by means of the means for varying the pressure between the piston (6) and the punched out part of the solder paste (3) takes place.
    [7]
    7. The method according to claim 6, wherein the means for varying the pressure between the piston (6) and the punched out part of the solder paste (3) comprises a membrane (8) which forms an end face of the piston (6).
    [8]
    8. The method according to claim 6, wherein the means for varying the pressure between the piston (6) and the punched out part of the solder paste (3) comprises a device for moving the piston (6) in the tubular body (4).
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    同族专利:
    公开号 | 公开日
    DE102015122011A1|2017-06-22|
    WO2017102213A1|2017-06-22|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE103421C|
    US5186982A|1990-09-18|1993-02-16|Minnesota Mining And Manufacturing Company|Pin transfer applicator and method|
    JPH07142489A|1993-11-17|1995-06-02|Matsushita Electric Ind Co Ltd|Formation of bump|
    JPH09219416A|1996-02-09|1997-08-19|Yamaha Corp|Method and device for manufacturing semiconductor device|
    US5834062A|1996-06-27|1998-11-10|Motorola, Inc.|Material transfer apparatus and method of using the same|
    US8012866B2|2008-05-30|2011-09-06|Asm Assembly Automation Ltd|Method of bonding semiconductor devices utilizing solder balls|
    FR2938460B1|2008-11-19|2012-01-13|Fp Soudage|BRAZING PRODUCT COMPRISING A BRAZING FLOW MIXTURE AND A DELIVERY METAL AND METHOD OF MANUFACTURE|
    法律状态:
    2020-06-15| PFA| Name/firm changed|Owner name: ENDRESS+HAUSER SE+CO. KG, DE Free format text: FORMER OWNER: ENDRESS+HAUSER GMBH+CO. KG, DE |
    2020-09-30| PFA| Name/firm changed|Owner name: ENDRESS+HAUSER SE+CO. KG, DE Free format text: FORMER OWNER: ENDRESS+HAUSER SE+CO. KG, DE |
    优先权:
    申请号 | 申请日 | 专利标题
    DE102015122011.3A|DE102015122011A1|2015-12-16|2015-12-16|Pipette for loading a printed circuit board|
    PCT/EP2016/077727|WO2017102213A1|2015-12-16|2016-11-15|Pipette for equipping a circuit card|
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